Silicon wafers are processed through an entire CMOS process and tested. Topics include Lot tracking, query processing, data collection, lot history, cycle time, turns, CPK and statistical process control, measuring factory performance, factory modeling and scheduling, cycle time management, cost of ownership, defect reduction and yield enhancement, reliability, process modeling and RIT's advanced CMOS process. The laboratory for this course is the student-run factory. Associated is a lab for on-campus section (01) and a graduate paper/case study for distance learning section (90).
Topics include CMOS process technology, work in progress tracking, CMOS calculations, process technology, long channel and short channel MOSFET, isolation technologies, back-end processing and packaging. This course focuses on CMOS manufacturing. Also advanced lithographic techniques and materials, including multi-layer techniques for BARC, double patterning, TARC, and next generation materials and processes are applied to optical lithography. Topics include the principles of photoresist materials, including polymer synthesis, photochemistry, processing technologies and methods of process optimization. Fundamentals of polymer technology will be addressed and the chemistry of various resist platforms including novolac, styrene, and acrylate systems will be covered.ĭouble patterning materials will also be studied. Microlithography Materials and Processes covers the chemical aspects of microlithography and resist processes. Applications of these fundamental thin film processes to IC manufacturing are presented. Plasma etching and Chemical Mechanical Planarization (CMP) are studied as methods for selective removal of materials. Physical and Chemical Vapor Deposition (PVD & CVD) are discussed as methods of film deposition. A thorough overview of vacuum technology is presented to familiarize the student with the challenges of creating and operating in a controlled environment. This course focuses on the deposition and etching of thin films of conductive and insulating materials for IC fabrication. Silvaco Athena and Atlas will be used extensively for process simulation. Particular emphasis will be placed on non-equilibrium effects. Device engineering challenges such as shallow-junction formation, fin FETs, ultra-thin gate dielectrics, and replacement metal gates are covered. A detailed study of processing modules in modern semiconductor fabrication sequences will be done through simulation. This is an advanced level course in Integrated Circuit Devices and process technology. Laboratory work also provides an introduction to basic IC fabrication processes and safety.3MCEE-602. The lab consists of conducting a basic metal gate PMOS process in the RIT clean room facility to fabricate and test a PMOS integrated circuit test ship. The students will be introduced to process modeling using a simulation tool such as SUPREM. The course will focus on basic silicon processing. The course presents an introduction to basic electronic components and devices, lay outs, unit processes common to all IC technologies such as substrate preparation, oxidation, diffusion and ion implantation. This course introduces the beginning graduate student to the fabrication of solid-state devices and integrated circuits. The degree requires strong preparation in the area of microelectronics and requires a thesis. Put your knowledge to work with a microelectronic engineering masters from RIT.The objective of the MS degree in microelectronic engineering is to provide an opportunity for students to perform graduate-level research as they prepare for entry into either the semiconductor industry or a doctoral program. With internationally renowned professors with years of experience, courses are grounded in reality – practical skill and advanced theory, combine for comprehensive learning. The microelectronic engineering masters provides a unique combination of physics, chemistry, and engineering in a state-of-the-art facility to prepare graduates for the real world.
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